Chip package

Details Chip package Chip package

2006-06-06

2009-02-24

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S680000

Reexamination Certificate

active

07495304

ABSTRACT:
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.

REFERENCES:
patent: 6744109 (2004-06-01), Barton et al.
patent: 6872984 (2005-03-01), Leung
patent: 7122874 (2006-10-01), Kim

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