4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Field effect device
  6. Having insulated electrode

Seung-bae Park

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active

Solder interconnect techniques

Joints and connections – Molded joint – Fusion bond – e.g. – weld – etc.
Reexamination Certificate

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Thermal deformation management for chip carriers

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Vertical channel semiconductor devices and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Vertical channel semiconductor devices and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Wafer scale thin film package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2413829

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