4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Electrolytic

Seshasayee Varadarajan

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Anode and anode chamber for copper electroplating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Reexamination Certificate

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Closed contact electroplating cup assembly

Chemistry: electrical and wave energy – Apparatus – Electrolytic
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Edge bevel removal of copper from silicon wafers

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
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Electroless copper fill process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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High compressive stress carbon liners for MOS devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Profile ID: LFUS-PAI-P-2237157

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