Closed contact electroplating cup assembly

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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Details

C204S297010, C204S297100, C204S297140, C204S279000

Reexamination Certificate

active

07985325

ABSTRACT:
Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

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