4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Seng Hooi Ong

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Electronic package with high density interconnect and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Stitched plane structure and process for package power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Stitched plane structure for package power delivery and dual...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2519343

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