4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Sejin Han

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Pressurized underfill encapsulation of integrated circuits

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Pressurized underfill encapsulation of integrated circuits

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Reservoir-slit rheometer for the viscosity measurement of fast-r

Measuring and testing – Liquid analysis or analysis of the suspension of solids in a... – Viscosity
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sejin Han does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Sejin Han, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sejin Han will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-170020

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure