Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1998-01-27
1999-12-14
Davis, Robert
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
425117, 425127, 4251291, 425149, 425544, 425546, 425547, 26427215, 26427217, B29C 3334, B29C 4502, B29C 4514
Patent
active
060009241
ABSTRACT:
A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.
REFERENCES:
patent: 2308453 (1943-01-01), Potchen et al.
patent: 2697253 (1954-12-01), Kruft
patent: 5049055 (1991-09-01), Yokoyama
patent: 5099090 (1992-03-01), Allan et al.
patent: 5123823 (1992-06-01), Banjo et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5522713 (1996-06-01), Lian
patent: 5609889 (1997-03-01), Weber
patent: 5766535 (1998-06-01), Ong
patent: 5766972 (1998-06-01), Takahashi et al.
Han Sejin
Wang Kuo K.
Cornell Research Foundation Inc.
Davis Robert
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