4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Seishiro Ohwaki

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Packaging structure for semiconductor IC chip

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging structure for semiconductor IC chip and method of pack

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Profile ID: LFUS-PAI-P-308390

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