Packaging structure for semiconductor IC chip and method of pack

Details Packaging structure for semiconductor IC chip and method of pack Packaging structure for semiconductor IC chip and method of pack

1977-03-11

1979-06-12

Dost, Gerald A.

Metal working

Method of mechanical manufacture

Assembling or joining

357 73, B01J 1700

Patent

active

041576110

ABSTRACT:
A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the binding agent is recessed with respect to the outer surface of the packaging or sealing members.

REFERENCES:
patent: 3059158 (1962-10-01), Doucette et al.
patent: 3308525 (1967-03-01), Tsuji et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3781976 (1974-01-01), Tomiwa
patent: 3885860 (1975-05-01), Sorkin

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