4. Metal fusion bonding
  5. Process
  6. Plural joints

Seishi Kumamoto

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Circuit board to be precoated with solder layers and solder circ

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Solder deposition method and solder bump forming method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Solder-precipitating composition and mounting method using the c

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-549143

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