Circuit board to be precoated with solder layers and solder circ

Details Circuit board to be precoated with solder layers and solder circ Circuit board to be precoated with solder layers and solder circ

1995-03-01

1995-09-26

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361767, 361771, H05K 118

Patent

active

054535824

ABSTRACT:
A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

REFERENCES:
patent: 3770874 (1973-11-01), Krieger et al.
patent: 4195195 (1980-04-01), de Miranda et al.
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4484704 (1984-11-01), Grassauer
patent: 4772762 (1988-09-01), Fukino
patent: 4893216 (1990-01-01), Hagner
patent: 5118029 (1992-06-01), Fuse et al.
patent: 5145532 (1992-09-01), Fukunaga et al.
Izumi Kosuga et al., U.S. Patent Application No. 07/852,526 filed Mar. 17, 1992.

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