Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-03-11
2000-12-12
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438111, H01L 2144, H01L 2148, H01L 2150
Patent
active
06159766&
ABSTRACT:
To determine leadframe tip positions, a circular arc portion where leadframe tips are to be arranged is determined so as to be opposed to each of the four corners of a die pad by performing a search. Then, straight line portions are set so as to extend from the circular arc portion and to be opposed to the die pad sidelines. The shape of each leadframe tip on the circular arc portion is defined as a region that is sectioned by two concentric circles and two radial rays extending from the center of the concentric circles. The division between the circular arc portion and straight line portions and the setting of the center of the circular arc portion are performed automatically. The leadframe tip width and interval are determined independently of each other.
REFERENCES:
patent: 5245214 (1993-09-01), Simpson
patent: 5313095 (1994-05-01), Tagawa et al.
patent: 5438021 (1995-08-01), Tagawa et al.
patent: 5451812 (1995-09-01), Gomi
patent: 5902119 (1999-05-01), Taki et al.
Arita Takashi
Goto Akihiro
Kawaguchi Hirochika
Ookyuu Satoshi
Suzuki Yasuhito
Jones Josetta
Mitsubishi Denki & Kabushiki Kaisha
Niebling John F.
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