4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Sandra Guy Malhotra

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Formation of aligned capped metal lines and interconnections...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Method for depositing metal films onto substrate surfaces...

Coating processes – Coating by vapor – gas – or smoke – Metal coating
Reexamination Certificate

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Method for forming an open-bottom liner for a conductor in...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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On-chip Cu interconnection using 1 to 5 nm thick metal cap

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2441053

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