4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Salman M. Kassir

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Chuck for supporting wafers with a fluid

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Method for applying an insert or tape to chucks or wafer...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method of backgrinding wafers while leaving backgrinding...

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Method of backgrinding wafers while leaving backgrinding...

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Method of spin etching wafers with an alkali solution

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2674358

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