Method of backgrinding wafers while leaving backgrinding...

Details Method of backgrinding wafers while leaving backgrinding... Method of backgrinding wafers while leaving backgrinding...

2006-06-13

2006-06-13

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Glass or stone abrading

C451S063000

Reexamination Certificate

active

07059942

ABSTRACT:
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.

REFERENCES:
patent: 5273615 (1993-12-01), Asetta et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 5720849 (1998-02-01), Yokosuka et al.
patent: 5951374 (1999-09-01), Kato et al.
patent: 5964646 (1999-10-01), Kassir et al.
patent: 6077149 (2000-06-01), Ohkuni et al.
patent: 6112740 (2000-09-01), Wark et al.
patent: 6120360 (2000-09-01), Ball et al.
patent: 6153536 (2000-11-01), Brouillette et al.
patent: 6273791 (2001-08-01), Kataoka et al.
patent: 6465330 (2002-10-01), Takahashi et al.
patent: 6612915 (2003-09-01), Uzoh et al.
patent: 6645474 (2003-11-01), Galdi et al.
patent: 6866564 (2005-03-01), Strasbaugh et al.
patent: 2002/0173872 (2002-11-01), Malik

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