Method of backgrinding wafers while leaving backgrinding...

Details Method of backgrinding wafers while leaving backgrinding... Method of backgrinding wafers while leaving backgrinding...

2005-03-15

2005-03-15

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Glass or stone abrading

C451S063000

Reexamination Certificate

active

06866564

ABSTRACT:
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.

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