Apparatus to decouple core circuits power supply from input-outp

Details Apparatus to decouple core circuits power supply from input-outp Apparatus to decouple core circuits power supply from input-outp

1996-05-30

1997-09-30

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257700, 257693, H01L 2352, H01L 2348

Patent

active

056729111

ABSTRACT:
A semiconductor device package for one or more semiconductor dice uses a package substrate having one pair of biplanar conductive planes and another pair of biplanar conductive planes. The pairs of planes are positioned in a coplanar relationship between the top traces and the bottom traces. Power may be supplied to die core circuits through one pair of planes and to die input-output circuits through another pair of planes to decouple the core circuits from the input-output circuits and minimize noise induced false switching in either set of circuits. The core circuits and the input-output circuits may be powered by the same power supply or separate power supplies.

REFERENCES:
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 5089881 (1992-02-01), Panicker
patent: 5218230 (1993-06-01), Tamamura et al.
patent: 5513076 (1996-04-01), Werther

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