Electrical die contact structure and fabrication method

Details Electrical die contact structure and fabrication method Electrical die contact structure and fabrication method

2008-03-04

2008-03-04

Tran, Dzung (Department: 2613)

Optical communications

Transmitter and receiver system

Including optical circuit board

C398S163000, C257S778000

Reexamination Certificate

active

10145295

ABSTRACT:
A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and a notch region along the edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The second surface of the semiconductor substrate includes a bottom protective layer with electrical connectors. The surface portion of the top protective layer includes electrical contact pads that are electrically interconnected with electrical contact pad extensions. The electrical contact pad extensions are interconnected with electrical connectors via a backside electrical connector that overlaps the electrical contact pad extensions forming a lap connection. Methods for constructing such devices and connections are also disclosed.

REFERENCES:
patent: 6040235 (2000-03-01), Badchi
patent: 6326689 (2001-12-01), Thomas
patent: 6781244 (2004-08-01), Prabhu

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