Carbon-carbon and/or metal-carbon fiber composite heat...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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C438S065000, C438S051000, C257SE21499

Reexamination Certificate

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10991621

ABSTRACT:
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

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Notification of Transmittal of the International Search Report and International Search Report for Application No. PCT/US 01/30352 filed Sep. 29, 2001 having a mailing date of Apr. 29, 2002.

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