Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-03-27
2007-03-27
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S065000, C438S051000, C257SE21499
Reexamination Certificate
active
10991621
ABSTRACT:
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.
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Notification of Transmittal of the International Search Report and International Search Report for Application No. PCT/US 01/30352 filed Sep. 29, 2001 having a mailing date of Apr. 29, 2002.
Chrysler Greg M.
Houle Sabina J.
Koning Paul A.
Blakely , Sokoloff, Taylor & Zafman LLP
Geyer Scott B.
Intel Corporation
Ullah Elias
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