Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-04-15
2008-04-15
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23102
Reexamination Certificate
active
07358606
ABSTRACT:
A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the identification of the location of the highest tensile and/or shear stress so that additional thermal interface material is deposited between the integrated heat spreader and a die. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
REFERENCES:
patent: 4683750 (1987-08-01), Kino et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5402006 (1995-03-01), O'Donley
patent: 5591034 (1997-01-01), Ameen et al.
patent: 5749988 (1998-05-01), Leibovitz et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 5903436 (1999-05-01), Brownell et al.
patent: 6002171 (1999-12-01), Desai et al.
patent: 6091603 (2000-07-01), Daves et al.
patent: 6117695 (2000-09-01), Murphy et al.
patent: 6169328 (2001-01-01), Mitchell
patent: 6188582 (2001-02-01), Peter
patent: 6238086 (2001-05-01), Mikubo et al.
patent: 6288900 (2001-09-01), Johnson et al.
patent: 6333551 (2001-12-01), Caletka et al.
patent: 6396700 (2002-05-01), Chu et al.
“U.S. Appl. No. 09/963,438 Final Office Action mailed May 5, 2003”, 34 pgs.
“U.S. Appl. No. 09/963,438 Non-Final Office Action mailed Sep. 13, 2002”, 14 pgs.
“U.S. Appl. No. 09/963,438 Notice of Allowance mailed Dec. 23, 2003”, 5 pgs.
“U.S. Appl. No. 09/963,438 Response filed Jul. 17, 2003 in response to Final Office Action mailed May 5, 2003”, 22 pgs.
“U.S. Appl. No. 09/963,438 Response filed Oct. 6, 2003 in response to Final Office Action mailed May 5, 2003”, 24 pgs.
“U.S. Appl. No. 09/963,438 Response filed Dec. 13, 2002 in response to Non-Final Office Action mailed Sep. 13, 2002”, 16 pgs.
“Flomerics Introduces FLOPACK for the Thermal Modeling of Electronic Packages”, www.flomerics.com
ews
ews—details.jsp?id=43, printed Aug. 16, 2002,(Oct. 1998),4 pages.
Bosak, Henry C., “A 3-D, Conjugate Thermal Analysis of Microprocessors”,FLOTHERM International User Conference, (May 1993),pp. 1-9.
Burdick, J. S., “Electronic Cooling at IBM Endicott”, IBM Information and Technical Communications Department, Endicott, NY 13760,(Aug. 1991),1-20.
Cheng, Yi-Kan, et al., “iCET: A Complete Chip-Level Thermal Reliability Diagnosis Tool for CMOS VLSI Chips”,ACM, Inc. 33rd Design Automation Conference, (1996),4 pages.
Haque, Ashium, “Processing and Characterization of Device Solder Interconnection and Module Attach for Power Electronics Modules”,PhD Dissertation, Virginia Polytechnic Institute and State University, Chapter 4,(Dec. 1999),pp. 71-108.
Jeakins, William D., “Thermal Analysis of a Ceramic Microelectronics Package Using Flotherm”,FLOTHERM International User Conference Presentations, (May 1993),12 pages.
Kromann, Gary B., “Thermal Modeling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies”,IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, vol. 18, No. 1,(Mar. 1995),pp. 87-93.
Mansingh, Vivek, et al., “Thermal Analysis of a Pin Grid Array Package”, Flomerics, Ltd.,11 pages.
Rosten, Harvey, et al., “DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment”, Flomerics Limited,21 pages.
Rosten, Harvey, et al., “Final Report to SEMITHERM XIII on the European-Funded Project DELPHI—the Development of Libraries and Physical Models for an Integrated Design Environment”, Flomerics Limited,18 pages.
Valenta, Pavel, “Thermal Modeling of Ball Grid Arrays”,Flotherm Technical Papers, www.flotherm.com/technical—papers/t169/t169.jsp, printed Aug. 16, 2002,14 pages.
“Definition of concave—Merriam-Webster Online Dictionary”, http://mw1.merriam-webster.com/dictionary/concave, 1 pg. Jun. 6, 2007.
Houle Sabina J.
Rumer Christopher L.
Andujar Leonardo
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
Soderholm Krista
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