4. Semiconductor device manufacturing: process
  5. Including control responsive to sensed condition
  6. Optical characteristic sensed

Rosalinda M. Ring

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Acoustic 3D analysis of circuit structures

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Apparatus and method for analyzing functional failures in...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Atomic force microscopy and signal acquisition via buried...

Semiconductor device manufacturing: process – With measuring or testing
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Circuit access and analysis for a SOI flip-chip die

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
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Circuit construction in back side of die and over a buried...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Profile ID: LFUS-PAI-P-2038289

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