4. Metal fusion bonding
  5. With means to cool work or product

Rolf A. Den Dopper

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Reflow soldering apparatus

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent

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Reflow soldering apparatus with improved cooling

Metal fusion bonding – With means to cool work or product
Patent

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Soldering device with shield of gas substantially excluding oxyg

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent

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Profile ID: LFUS-PAI-P-940023

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