Metal fusion bonding – With means to cool work or product
Patent
1997-06-11
2000-03-21
Ryan, Patrick
Metal fusion bonding
With means to cool work or product
228222, 2282332, 2282341, 432 85, B23K 100, B23K 3102, B23K 3538, F27D 1502
Patent
active
060392363
ABSTRACT:
A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.
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Ryan Patrick
Soltec B.V.
Stoner Hiley
LandOfFree
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