Reflow soldering apparatus

Details Reflow soldering apparatus Reflow soldering apparatus

1993-07-20

1995-04-11

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

219388, 432128, 432152, B23K 1012

Patent

active

054050740

ABSTRACT:
The invention relates to a soldering apparatus comprising: a soldering chamber; transporting means for transporting the objects to be soldered through the soldering chamber; and heating means for heating the objects to be soldered in the soldering chamber, wherein the heating means are formed by means for feeding heated gas to the chamber. A simple device is thus obtained which heats uniformly. Such an apparatus can be embodied in both closed and open form. According to one of the preferred embodiments the means for feeding heated gas are formed by at least one heating unit, wherein the heating units are each formed by a fan and at least one heating device, for instance an electrical heating filament, connected forwardly thereof. Cooling units can also be used.

REFERENCES:
patent: 4909430 (1990-03-01), Yokota
patent: 5069380 (1991-12-01), Deambrosio
patent: 5154338 (1992-10-01), Okuno et al.
patent: 5172849 (1992-12-01), Barten et al.
Patent Abstracts of Japan, vol. 16, No. 232 (M-1256), May 28, 1992 & JP,A,40 46 667 (Matsushita Electric Ind. Co. Ltd.) Feb. 17, 1992.
Patent Abstracts of Japan, vol. 16, No. 232 (M-1256) May 28, 1 1992 & JP,A,40 46 666 (Eitetsuku Tekutoron KK) Feb. 17, 1992.

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