4. Computer-aided design and analysis of circuits and semiconductor
  5. Design of semiconductor mask or reticle
  6. Manufacturing optimizations

Robert Rumsey

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Chip-scale package conversion technique for dies

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Manufacturing optimizations
Reexamination Certificate

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Integrating chip scale packaging metallization into...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Integrating chip scale packaging metallization into...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2280254

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