4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough

Robert B. Crispell

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active

Lead structure for sealing package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Plastic overmolded packages with mechancially decoupled lid...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Plastic overmolded packages with mechanically decoupled lid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Plastic overmolded packages with mechanically decoupled lid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2595716

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