4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Rick C. Lake

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Microelectronic devices and methods for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Systems and methods for depositing conductive material into...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2296891

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