Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate
2005-08-30
2010-12-07
King, Roy (Department: 1793)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
C228S218000, C228S259000
Reexamination Certificate
active
07845540
ABSTRACT:
Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.
REFERENCES:
patent: 2821959 (1958-02-01), Franz
patent: 3006318 (1961-10-01), Monroe, Jr. et al.
patent: 3865298 (1975-02-01), Allen et al.
patent: 4301771 (1981-11-01), Jukkola et al.
patent: 4706602 (1987-11-01), Polacek
patent: 4799616 (1989-01-01), Simpson et al.
patent: 5043299 (1991-08-01), Chang et al.
patent: 5110036 (1992-05-01), Parker, Jr.
patent: 5755888 (1998-05-01), Torii et al.
patent: 6342104 (2002-01-01), Kamikawa et al.
patent: 6708872 (2004-03-01), Gruber et al.
patent: 6796483 (2004-09-01), Weber et al.
patent: 6910487 (2005-06-01), Mertens et al.
patent: 6923117 (2005-08-01), Onishi et al.
patent: 2004/0050408 (2004-03-01), Christenson et al.
patent: 2083135 (1991-05-01), None
patent: 171536 (1991-10-01), None
patent: 174529 (1991-12-01), None
patent: 556254 (2003-10-01), None
Yamamoto, S. et al., “Si Through-Hole Interconnections Filled with Au-Sn Solder by Molten Metal Suction Method,” pp. 642-645, IEEE, MEMS-03 Kyoto, The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Jan. 2003, ISBN 0-7803-7744-3.
International Search Report and Written Opinion for International Application No. PCT/US2006/031309, 10 pages, mailed Jan. 15, 2007.
Office Action (translation) issued Nov. 20, 2008 in R.O.C. (Taiwan) Application No. 095131076.
Office Action (translation) issued Aug. 27, 2010 in R.O.C. (Taiwan) Application No. 095131076.
Dando Ross S.
Lake Rick C.
Aboagye Michael
King Roy
Micro)n Technology, Inc.
Perkins Coie LLP
LandOfFree
Systems and methods for depositing conductive material into... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems and methods for depositing conductive material into..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for depositing conductive material into... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4191524