4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Richard Pommer

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Lasable bond-ply materials for high density printed wiring...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method of making a multi-layer interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Multi-layer interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Removing inherent stress via high temperature annealing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Small-scale optoelectronic package

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
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Profile ID: LFUS-PAI-P-2495364

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