Small-scale optoelectronic package

Details Small-scale optoelectronic package Small-scale optoelectronic package

2005-06-28

2005-06-28

Nelms, David (Department: 2818)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C257S200000, C257S686000, C257S777000, C385S014000, C385S024000, C385S052000

Reexamination Certificate

active

06910812

ABSTRACT:
An integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector. Alignment is accomplished with complementary guide pins that pass through guide holes in the fiber optic connector and in the transparent substrate.

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