4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Richard L. Groover

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Electrically and thermally enhanced package using a separate sil

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Thermally enhanced chip scale lead on chip semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-1117028

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