Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
Inventor
active
Process for bonding a semiconductor die to a variable die size i
Semiconductor device having a universal die size inner lead layo
Semiconductor device having an universal die size inner lead lay
Semiconductor device having an universal die size inner lead lay
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Profile ID: LFUS-PAI-P-735547