Process for bonding a semiconductor die to a variable die size i

Details Process for bonding a semiconductor die to a variable die size i Process for bonding a semiconductor die to a variable die size i

1994-01-03

1996-08-27

Fourson, George

Fishing, trapping, and vermin destroying

437220, H01L 2158, H01L 2160

Patent

active

055500870

ABSTRACT:
A process for manufacturing substrate including a non-conductive support layer and a plurality "n" of conductive leads disposed on the support layer. The leads are arranged in a generally radial pattern about a central point on the support layer, each of the leads having a width "w" and spaced a distance "d" from one another at their innermost ends, thereby forming a generally square opening of side dimension "s". The substrate accommodates semiconductor dies ranging in size from smaller than the opening, to approximately equal to that of the opening, to substantially larger than the opening, such as four times the size (linear dimension) of the opening. The die is bonded to the substrate. Other elements of a semiconductor device assembly are added to the resulting structure.

REFERENCES:
patent: 3984860 (1976-10-01), Logue
patent: 4080512 (1978-03-01), Ramet et al.
patent: 4190855 (1980-02-01), Inoue
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4258381 (1981-03-01), Inaba
patent: 4408218 (1983-10-01), Grabbe
patent: 4706105 (1987-11-01), Masuda et al.
patent: 4771330 (1988-09-01), Long
patent: 4772936 (1988-09-01), Reding et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4949160 (1990-08-01), Ohno
patent: 4984057 (1991-01-01), Kubota et al.
patent: 4985748 (1991-01-01), Belanger, Jr.
patent: 4999700 (1991-03-01), Dunaway
patent: 5006919 (1991-04-01), Disko

Affiliated with

Also associated with

Rating

Process for bonding a semiconductor die to a variable die size i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for bonding a semiconductor die to a variable die size i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for bonding a semiconductor die to a variable die size i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1056116