Beryllium copper plating process

Details Beryllium copper plating process Beryllium copper plating process

1976-02-17

1977-06-07

Edmundson, F.C.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428929, 204 28, 204 32R, 204 37R, 204 40, 428649, 428673, C25D 512, C25D 534, C25D 550

Patent

active

040280640

ABSTRACT:
A process for plating beryllium copper with an excellent electrically conductive material such as gold for use in high reliability applications wherein a heat treating step is employed after forming to yield a desired hardness spring temper comprising the steps of: providing a copper-rich surface on the beryllium copper; electroplating the copper-rich surface with a diffusion barrier preplate; heat treating the beryllium copper material to a desired temper; and electroplating the material with a high electrically conductive material. This process provides for a void-free, durable gold plate which can be produced by a continuous automated strip plating line before and after heat treating.

REFERENCES:
patent: 3189532 (1965-06-01), Chow et al.
patent: 3556957 (1971-01-01), Toledo et al.
patent: 3622474 (1971-11-01), Greenspan
patent: 3920409 (1975-11-01), Taniguchi
patent: 3925170 (1975-12-01), Skomoroski et al.

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