4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Randall L. Walberg

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Inkjet printed leadframe

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Inkjet printed leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Molded optical package with fiber coupling feature

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3269754

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