Molded optical package with fiber coupling feature

Details Molded optical package with fiber coupling feature Molded optical package with fiber coupling feature

2008-07-22

2010-06-01

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S098000, C257S099000, C257S100000, C257S116000, C257S117000, C257S118000, C257S432000, C257S433000, C257SE33056, C257SE33058, C257SE33059, C257SE33066, C257SE33073

Reexamination Certificate

active

07728399

ABSTRACT:
Apparatuses and methods directed to an integrated circuit package having an optical component are disclosed. The package may include an integrated circuit die having at least one light sensitive region disposed on a first surface thereof. By way of example, the die may be a laser diode that emits light through the light sensitive region, or a photodetector that receives and detects light through the light sensitive region. An optical concentrator may be positioned adjacent the first surface of the first die. The optical concentrator includes a lens portion positioned adjacent the light sensitive region and adapted to focus light.

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