4. Metal fusion bonding
  5. Process
  6. Plural joints

Ralph E. Cornell

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Solder bump transfer device for flip chip integrated circuit dev

Metal fusion bonding – Process – Plural joints
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Solderable contacts for flip chip integrated circuit devices

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Profile ID: LFUS-PAI-P-1865574

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