Solderable contacts for flip chip integrated circuit devices

Details Solderable contacts for flip chip integrated circuit devices Solderable contacts for flip chip integrated circuit devices

1995-03-23

1996-08-20

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

364488, 364489, 364490, 364491, 22818021, 22818022, B32B 900

Patent

active

055477402

ABSTRACT:
A flip chip integrated circuit device (110) is provided having a surface, a perimeter, and solder bumps (112) located on the surface. At least one solder bump (112), and preferably a plurality of solder bumps (112), are spaced apart from the perimeter of the device (110). Electrically conductive runners (118) extend from the perimeter of the device (110) to each of those solder bumps (112) that are spaced apart from the perimeter, so as to electrically interconnect the solder bumps (112) to a point, such as a pad (116), at the perimeter. As a result, not all of the solder bumps (112) employed by the device (110) need be accommodated at the perimeter of the device (110), such that the size and number of the solder bumps (112) does not dictate the size of the device (110).

REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 3387365 (1968-01-01), Stelmark
patent: 3403438 (1968-10-01), Best et al.
patent: 3436818 (1969-04-01), Merrin et al.
patent: 4722060 (1988-01-01), Quinn et al.
patent: 5118584 (1992-06-01), Evans et al.
patent: 5220200 (1993-06-01), Blanton
patent: 5261593 (1993-11-01), Casson et al.

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