4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Ralf Hausner

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Method for joining a silicon plate to a second plate

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Micromechanical device which has cavities having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2854945

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