Micromechanical device which has cavities having different...

Details Micromechanical device which has cavities having different... Micromechanical device which has cavities having different...

2009-08-04

2011-10-11

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With desiccant, getter, or gas filling

C257S684000, C257S723000, C257SE23180, C257SE23181, C257SE23128

Reexamination Certificate

active

08035209

ABSTRACT:
A micromechanical device having a substrate wafer has at least one first cavity and one second cavity, the cavities being hermetically separated from each other, the first cavity having a different internal atmospheric pressure than the second cavity. The cavities are capped by a thin film cap. A method is for manufacturing a micromechanical device which has a thin film cap having cavities of different internal atmospheric pressures.

REFERENCES:
patent: 2002/0051258 (2002-05-01), Tamura
patent: 2008/0136000 (2008-06-01), Fischer et al.
patent: 2010/0025845 (2010-02-01), Merz et al.

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