4. Metal fusion bonding
  5. Process
  6. Plural joints

Phil Geng

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Design and assembly methodology for reducing bridging in...

Metal fusion bonding – Process – Plural joints
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Methods of fabricating a via-in-pad with off-center geometry

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
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Via-in-pad with off-center geometry

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2577676

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