Methods of fabricating a via-in-pad with off-center geometry

Details Methods of fabricating a via-in-pad with off-center geometry Methods of fabricating a via-in-pad with off-center geometry

2007-04-24

2007-04-24

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S612000, C257S774000, C257S786000, C361S767000, C361S777000

Reexamination Certificate

active

10994995

ABSTRACT:
The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.

REFERENCES:
patent: 4024629 (1977-05-01), Lemonie et al.
patent: 5315485 (1994-05-01), Magill et al.
patent: 5425816 (1995-06-01), Cavicchi et al.
patent: 5464682 (1995-11-01), Perfecto et al.
patent: 5489750 (1996-02-01), Sakemi et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5706178 (1998-01-01), Barrow
patent: 5784262 (1998-07-01), Sherman
patent: 5796589 (1998-08-01), Barrow
patent: 5815374 (1998-09-01), Howell
patent: 5875102 (1999-02-01), Barrow
patent: 5936309 (1999-08-01), Kim
patent: 5936848 (1999-08-01), Mehr et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 6429389 (2002-08-01), Chung et al.
patent: 6622905 (2003-09-01), Shier et al.
patent: 6833615 (2004-12-01), Geng et al.
patent: 08-083975 (1996-03-01), None
patent: 08-288658 (1996-11-01), None
patent: 2000-174410 (2000-06-01), None
patent: 2000-183531 (2000-06-01), None
patent: WO-00/22894 (2000-04-01), None

Affiliated with

Also associated with

Rating

Methods of fabricating a via-in-pad with off-center geometry does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of fabricating a via-in-pad with off-center geometry, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of fabricating a via-in-pad with off-center geometry will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3790772