4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Peter Ingram

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Forward and reverse blocking devices

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including high voltage or high power devices isolated from...
Reexamination Certificate

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Method and connecting material for the metallic joining of parts

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Method for fabricating forward and reverse blocking devices

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1201214

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