Method and connecting material for the metallic joining of parts

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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228123, 22826312, 228 563, B23K 3102, B23K 3526

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active

047460555

ABSTRACT:
Method for the metallic joining of parts which are formed by semiconductor components with metallization on at least one side or by metallic components or metallic substrates. A composite multilayer material is arranged between the parts to be joined together. Subsequently, the components are joined together at least under the action of defined heat such that only the surface layers directly facing the parts of the composite material are softened.

REFERENCES:
patent: Re30348 (1980-07-01), Hascoe
patent: 2354409 (1944-07-01), Strasser
patent: 3254393 (1966-06-01), Grasser
patent: 3392899 (1968-07-01), Hoogstoel
patent: 3651562 (1972-03-01), Hambleton
patent: 3787958 (1974-01-01), Freedman et al.
patent: 4529836 (1985-07-01), Powers et al.

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