Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1987-05-22
1988-05-24
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228123, 22826312, 228 563, B23K 3102, B23K 3526
Patent
active
047460555
ABSTRACT:
Method for the metallic joining of parts which are formed by semiconductor components with metallization on at least one side or by metallic components or metallic substrates. A composite multilayer material is arranged between the parts to be joined together. Subsequently, the components are joined together at least under the action of defined heat such that only the surface layers directly facing the parts of the composite material are softened.
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patent: 3651562 (1972-03-01), Hambleton
patent: 3787958 (1974-01-01), Freedman et al.
patent: 4529836 (1985-07-01), Powers et al.
Ingram Peter
Jahnke Bernd
Neidig Arno
Brown Boveri & Cie AG
Godici Nicholas P.
Greenberg Laurence A.
Heinrich Samuel M.
Lerner Herbert L.
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