4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Paul W. Dryer

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Method and apparatus for semiconductor wafer cleaning with...

Cleaning and liquid contact with solids – Apparatus – With alarm – signal – indicating – testing – inspecting,...
Reexamination Certificate

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Method for etching a dielectric layer on a semiconductor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Method of bonding a micro-fluid ejection head to a support...

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1432222

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