Method of bonding a micro-fluid ejection head to a support...

Details Method of bonding a micro-fluid ejection head to a support... Method of bonding a micro-fluid ejection head to a support...

2007-04-12

2010-06-15

Do, An H (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S054000

Reexamination Certificate

active

07735952

ABSTRACT:
A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.

REFERENCES:
patent: 4178403 (1979-12-01), Sakurai et al.
patent: 4670967 (1987-06-01), Hazuki
patent: 6787051 (2004-09-01), Silverbrook
patent: 7287831 (2007-10-01), Silverbrook
Plobl, Andreas, et al. , “Wafer Direct Bonding: Tailoring Adhesion Between Brittle Materials,” Materials Science and Engineering, 1-88, (1999) [Retrieved on Jul. 28, 2008]. <URL: http://www.mpi-halle.de/mpi/publi/pdf/782—99.pdf> entire document especially Fig 23, Fig 29, p. 28, para 1, p. 30, para 1 p. 49, para 2.

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