4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Paul Anthony Zucco

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Reworkable polymer chip encapsulant

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Reworkable polymer chip encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Profile ID: LFUS-PAI-P-1078335

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