Reworkable polymer chip encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

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257787, H01L 2328

Patent

active

056592035

ABSTRACT:
A C4 or flip chip reworkable electronic device is provided comprising integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

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