Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1997-04-15
1999-07-27
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438127, H01L 2144, H01L 2148, H01L 2150
Patent
active
059305975
ABSTRACT:
A C4 or flip chip reworkable electronic device is provided comprising an integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.
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Buchwalter Stephen Leslie
Call Anson Jay
Iruvanti Sushumna
Jasne Stanley J.
Moreau Wayne Martin
International Business Machines - Corporation
Jones Josetta I.
Niebling John F.
Soucar Steven J.
Tomaszewski John J.
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