4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Patrizia Sonego

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Method of planarizing a semiconductor device by depositing a die

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Planarization structure and method for dielectric layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Process for depositing a stratified dielectric structure for enh

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent

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Process for realizing an intermediate dielectric layer for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Process for realizing an intermediate dielectric layer for...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1132054

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